
ADDITIONAL CUSTOMIZATION, TIME ECONOMY AND ICONS ARE IN THE PIPELINE. NOTE: ACTIONS ARE CURRENTLY 6s EACH, AND THE COUNTDOWN IS HARD SET TO 30s.ON TRIGGER, STARTS A COUNTDOWN WHICH ACTIVATES ANOTHER EFFECT WHEN IT REACHES ZERO! (NEW) ADDED A NEW HOMEBREW TRACE TRAP.(NEW) ADDED A TIMER IN THE CORNER WHICH INCREASES WHEN ACTIONS ARE TAKEN.NOTE: IF ANY OF YOUR NODES FROM AN EXISTING SAVE APPEAR DISABLED ON LOAD, JUST REPLACE IT WITH A NEW NODE AND SAVE. (NEW) ONCE A TRAP IS UNLOCKED AND THE USER HAS ACCESS, IT CAN BE DISARMED WITH THE 'TOG.ARM' ACTION.(NEW) NODES CAN NOW BE AFFECTED BY MULTIPLE TRAPS AT THE SAME TIME!.A TARGET (DOTTED) LINE IS USED TO SHOW THE CONNECTION. INSTEAD, USE THE GUARD ACTION AND ASSIGN TARGETS. (NEW) TRAPS NO LONGER AFFECT THEIR PARENTS.NOTE: FOR EXISTING ENCOUNTERS, YOU WILL HAVE TO RECONFIGURE YOUR TRAPS TO USE THE NEW SYSTEM.
HOMER PRO SIMULATION TOOL UPDATE
HAPPY 2020, STARFINDERS! v0.16 BRINGS A BIG UPDATE TO THE PROJECT, MAINLY REVOLVING AROUND HOW TRAPS WORK! NOTE: THIS FEATURE IS CURRENTLY NOT YET IMPLEMENTED AND DOESN'T HAVE ANY TIME EFFECT YET.
HOMER PRO SIMULATION TOOL PATCH
Introducing Ansys Nuhertz FilterSolutions - an RF and digital filter design, synthesis and optimization solution with Ansys HFSS integration.BEEN SICK ALL WEEKEND, SO I HAMMERED OUT SOME EXTRA GOODIES IN A QUICK PATCH TO GO WITH THE NEW PUBLIC REPOS PATCH FROM A FEW DAYS AGO.Multiphysics enhancements broaden applications of NVH in electromechanical devices and improve the thermal dependency response of permanent magnets.Ansys Maxwell 2D skew model enables 3D simulation accuracy of electrical machines at the speed of 2D.Ansys Maxwell A-Φ solver enhances conductive EMC analysis for busbars, power electronics and PCBs.Icepak solver improvements enable 10 to 100X faster times for MCAD geometry processing and solving. Ansys Icepak’s Joule heating analysis solves coupled electrothermal problems with static or transient excitations, while thermal ROM simplifies setup for variable flow rate problems.With EMA3D Cable’s mesh subgrid, engineers can define regions in the model where the mesh cell size can be different from the rest of the model.Ansys SI Xplorer helps PCB designers to define stack-up and optimize via transitions.


Ansys HFSS Phi Plus meshing dramatically increases speed and capacity for 3D IC packaging simulation, including wire bonds.Ansys introduces the Electronics Desktop Student version.Ansys 2021 R2 delivers groundbreaking technologies to address challenges in 3D IC, autonomy, 5G and electrification.
